ebeam Technologies has announced that its international educational seminar series will continue in 2018, kicking-off in Atlanta, GA, USA on January 25.

The seminar will look at the current state and needs of the flexible packaging market and will include an overview of the latest advancements in low migration ebeam curing along with new solutions for flexible consumer product packaging applications. Printers, packaging printers, converters and finishers will learn about the benefits that ebeam technology can deliver for their businesses from presentations by leading industry experts on photopolymer chemistry and low energy electron beam surface curing technology.

The seminar will take place at the Georgia Power Customer Resource Center, on January 25, 8 am – 4:30 pm, and is now open for registration on the ebeam website.

The session will feature presentations on:

• Electron beams and inkjet ink technology
• Photopolymer chemistry and curing processes
• Photopolymer chemistry and indirect food-contact compliance
• Advancements in primers and varnishes
• Advancements in laminating adhesives

During the seminar, attendees will have the opportunity to network over lunch, as well as engage in a roundtable discussion.

The seminar forms part of an ongoing series of engaging and thought-provoking sessions that make electron beam technology more accessible. Past sessions have been held in China, Japan, Germany, UK, and Belgium to great success and have highlighted the benefits for businesses and solution developers.